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Themis' USPIIIi is a high-performance family of single-
and dual-processor SPARC®-based VMEbus computers for military,
telecommunications, and embedded processing applications.
Featuring a new system architecture with 1.28 GHz UltraSPARC
IIIi processors and dual 160-MB/s ultra-SCSI ports, the USPIIIi
is designed to provide users the industrys best data
bandwidth, 2-way scalability, and server class I/O.
The USPIIIi is a next generation computer suitable for demanding
new applications or as an upgraded replacement of earlier
USP-2 SMP VME products. The USPIIIi leverages Themis' USPIIe-USB
product family, and may be configured with either one or two
UltraSPARC IIIi CPUs. The single-processor configuration consists
of an I/O board and a CPU board assembly occupying two VME
slots. A dual-processor configuration occupies three VME slots.
Each USPIIIi CPU has a local SMP readable 4-GB memory, both
processors of a dual-processor configuration can access up
to 8-GB of memory.
Like its USP-2 predecessor, the USPIIIi provides excellent
Sun® graphics support. The optional Themis TGA3D+
incorporates Sun XVR-500 graphics technologies and is supported
by the Solaris Operating Environment. An Ultra160 SCSI
interface is used to support the increased bandwidth of today's
high-performance LVD SCSI devices; while automatic backward-compatibility
modes protect your investment by assuring that earlier single-ended
SCSI devices will continue to function properly.
4-GB 266DDR SDRAM memory per CPU, 8-GB total
Memory bandwidth4.2-GB /sec (Peak), 3.3-GB/sec
(Sustained)
Processor bus bandwidth3.2-GB/sec (Peak)
Optional TGA3D+ graphicsincorporates Sun XVR-500
graphics technologies
Gigabit Ethernet port
One 64-bit/66-MHz PMC slot
Up to 3 PMC expansion slots (up to 5 slots with optional
TGA3D+ graphics)
Dual FC-AL ports
Additional VME-backplane access
Solaris Operating Environment support for superior
scalability
Rugged design for reliability in harsh operating environmentsup
to 30G shock
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