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The Themis Mission and Payload Systems Initiative (MPSI)
is aimed at providing integrated system solutions and value-added
services to Themis military and aerospace customers.
As a part of the MPSI, Themis has assembled an ever-growing
suite of 3U VPX conduction cooled hardware to use as building
block solutions for these applications. The new Themis hardware
includes both a 5-Slot conduction cooled chassis, as well
as an 8-Slot ½ ATR conduction cooled chassis with Universal
Cooling and Configuration Options.
Complementing Themis' new 3U VPX rugged chassis products
are an Intel® Core i7 based Single Board Computer,
an ATI E4690 based General Purpose Graphics Processing Unit
(GPGPU), an 8 channel SATA / SAS RAID Controller with PMC/XMC
mezzanine site, a 3U VPX Conduction cooled FLASH card with
up to 256 GB capacity, and a general purpose PMC/XMC carrier
card for miscellaneous I/O. Themis will also provide integration
services and support for third party partner companies that
will provide Software Defined Radio (SDR) functionality, FPGA
& Power PC Processing, as well as Avionics Data Bus Interfaces,
including MIL-STD-1553 and ARINC 429. Themis' approach to
providing integrated system solutions utilizing this 3U VPX
hardware includes being able to deliver a variety of "Off-the-Shelf"
system configurations in a very short period of time, often
in 60 to 90 days.
More 3U VPX Module
Product Information >>
As part of the larger MPSI, Themis has also developed the
capability to integrate its air cooled Intel and SPARC processors
into airborne systems utilizing ½ ATR and ¾
ATR convection cooled rugged chassis products.
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